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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 36(2); 2003
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2003;36(2):168-175. Published online: Nov, 30, -0001
도금공정의 액 분석에 따른 Solderability 개선 연구
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삼성전기 MLCC사업부;
초록
The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB`s. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderabil
키워드 Sn/Pb도금;액분석;